TI CC2340R5 continues the classic, wireless module promotes low-power Bluetooth applications
TI CC2340R5 continues the classic, wireless module promotes low-power Bluetooth applications
Blog Article
With the rise of the Internet of Things, the market demand for low-power Bluetooth continues to grow. As a senior member of the SIG (Special Interest Group), TI plays a leading and promoting role in the field of low-power Bluetooth. Since the release of BLE 4.0 in 2010, TI has taken the lead in launching the first generation CC254x series of low-power Bluetooth SoCs and has continuously introduced new products, including the CC2640 series Bluetooth SoCs, CC26x1/2/4 serial wireless SoCs, and the latest fourth-generation low-power Bluetooth wireless SoC—CC2340. This series of Bluetooth wireless SoCs supports Bluetooth 5.3, Zigbee and 2.4G private protocols, has excellent low-power performance and affordable prices, and can be used in smart homes, medical, industrial control and automotive fields. As a third-party solution design company authorized by TI, Infostar Technology has launched a variety of wireless communication modules for TI's multiple series of SoCs for decades, and is committed to promoting the development of the wireless Internet of Things.
The Bluetooth 4.0 protocol is a Bluetooth standard released by SIG (Special Interest Group) in June 2010. It has two modes: BLE (Bluetooth low energy) can only communicate with 4.0 protocol devices, suitable for energy-saving devices that only send and receive small amounts of data (such as home electronics); BR/EDR (Basic Rate / Enhanced Data Rate), backward compatible (can communicate with 3.0/2.1/2.0), suitable for devices that send and receive more data (such as headphones).
TI launched the industry's first BLE 4.0 chip in 2010 - CC254x, which uses an 8051 core, has 8 KB RAM, 256 KB programmable FLASH and a wealth of peripheral interfaces, uses low-power technology, supports multiple energy-saving modes, and makes the power consumption in the working and sleeping states very low, maximizing the device usage time. Based on CC2540, Xinchida Technology launched RF-BM-S01, RF-BM-S02, RF-BM-S02I, RF-CC2540A1, and based on CC2541, launched RF-BM-S01A, RF-BM-S02A, RF-BMPA-2541B1 and other low-power Bluetooth modules, which are widely used in consumer medical, wearable portable devices, security, entertainment and home automation, and are still being shipped.
In 2015, Texas Instruments (TI) launched the second-generation BLE SoC (system-on-chip) - CC2640. The core of this generation of SoC transitioned from 8051 to Arm Cortex-M3 architecture. While increasing storage capacity, it supports BLE 5 standards and is compatible with Bluetooth 4.x versions. This upgrade not only further optimizes performance and power consumption, but also makes CC2640 suitable for IoT application scenarios that require low power consumption and small size, such as home and building automation, health care, fitness and medical equipment, wearable devices, and industrial automation. Based on CC2640R2F, CC2640R2L and CC2640R2F-Q1 chips, RF-Star Technology has launched a number of serial-to-Bluetooth transparent transmission modules, including RF-BM-4044B2, RF-BM-4044B3, RF-BM-4044B4, RF-BM-4044B5, RF-BM-4077B1, RF-BM-4077B1L, RF-BM-4055B1L and RF-BM-4077B2. With its excellent RF performance, low power consumption, stability, transmission distance and support for standard serial port transparent transmission, it has been recognized by many industry customers and has been widely used in new energy vehicles, charging piles, battery swap stations and BMS. The RF-BM-4044B4 module has a tiny size of only 8 mm×8 mm and is favored by customers in scenarios with requirements on product size, such as portable medical equipment.
In 2019, TI launched the third-generation CC26x1/2/4 products, which support BLE's Mesh networking and positioning functions, as well as multiple protocols including Zigbee, Thread, Matter, etc., greatly enriching the product line; at the same time, it also launched the CC1352 series dual-band multi-protocol wireless SoC, which can simultaneously support Sub-1 GHz and 2.4 GHz dual-bands, including Thread, Zigbee, BLE 5.2, IEEE 802.15.4g, 6LoWPAN, MIOTY, Wireless M-Bus, Wi-SUN, KNX RF, Amazon Sidewalk, proprietary systems, SimpleLink TI 15.4- Stack (Sub-1 GHz) and other protocols. Compared with the CC2640 series, the CC2642R, CC2652, and CC1352 series not only have improved transmission power range, but also have further increased RAM and FLASH storage resources. The main parameter comparison and module information launched by Xinchida Technology for each series are shown in Table 1. Due to the characteristics of low power consumption, high performance and multi-protocol, they can be used in the Internet of Things (IoT), smart homes, smart buildings, medical equipment, energy management, security systems, industrial automation and other fields.
Speaking of multi-protocol, we have to talk about DMM, which stands for Dynamic Multi-Protocol Manager. It is a software module that enables a single radio to run multiple wireless protocols simultaneously by switching between multiple wireless protocols in real time, also known as "time division multiplexing", where the radio switches between two protocol stacks by changing settings, channels and other parameters. DMM may modify the scheduling order of RF commands based on the limitations of the protocol stack and user application, and by switching between protocol stacks in real time, it is possible to run multiple wireless protocols simultaneously on a single MCU. RF-Star Technology's RF-BM-2642B1/B2 based on CC2642R has powerful resource configuration and supports Bluetooth 5.1 AoA positioning, which can be applied to Bluetooth PEPS for new energy vehicles. It also provides a variety of antenna forms for users to choose from, and reserves a wealth of general IOs to facilitate customers to independently develop multi-protocol communication wireless products.
Compared with the previous three generations of Bluetooth wireless SoCs, the CC2340 series Bluetooth wireless SoCs support Bluetooth 5.3, Zigbee and 2.4G private protocols, have lower power consumption, a maximum transmit power of +8 dBm, an industry-leading -102 dBm sensitivity, excellent RF performance, and are extremely cost-effective. They can be used in portable medical devices, wearable devices, smart homes, wireless remote control devices, lighting, industrial control, and automotive fields. Based on CC2340R5, Xinchida Technology has launched a number of Bluetooth modules, including RF-BM-2340B1, RF-BM-2340B1I, RF-BM-2340A2, RF-BM-2340A2I, RF-BM-2340C2, etc., which support multiple antenna forms, provide multiple size versions, support Bluetooth 5.0 standard transparent transmission protocol, and are Pin to Pin compatible with Xinchida's RF-BM-4044B2, RF-BM-4044B3, RF-BM-4044B4 and other Bluetooth transparent transmission modules. It supports customer customized firmware development and can also provide technical support for customers' independent development, so that customers can shorten the development cycle and quickly launch products to the market.
With the mass production and launch of TI CC2340R5 and CC2340R2 SoCs, as well as the subsequent launch of automotive-grade CC2340 SoCs, RF-Star Technology will spare no effort to launch more high-performance and cost-effective Bluetooth wireless modules to continuously empower wirelessization in more industries.
Dose TI CC2340R5 Support Bluetooth® 5 ?
Yes Support for Bluetooth® 5 features: High Speed Mode (2 Mbps PHY), Long Range (LE Coded 125 kbps and 500 kbps PHYs), Privacy 1.2.1 and Channel Selection Algorithm #2, as well as backwards compatibility and support for key features from the Bluetooth® 4.2 and earlier Low Energy specifications.
Dose TI CC2340R5 Support Wi-Fi, Bluetooth Low Energy, Thread, Zigbee?
Yes .The CC2340R5-Q1 device is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change.
Product Details: Chipmall TI CC2340R5
Quote: Chipmall TI CC2340R5